(Graphic: Business Wire)Ĭhip designers creating hyperscale computing, consumer, 5G communications, mobile and automotive applications can achieve greater productivity with the Integrity 3D-IC platform versus a disjointed die-by-die implementation approach. The Cadence® Integrity™ 3D-IC platform is the industry’s first comprehensive, high-capacity 3D-IC platform that integrates 3D design planning, implementation and system analysis in a single, unified cockpit. The Integrity 3D-IC platform underpins Cadence’s third-generation 3D-IC solution, providing customers with system-driven power, performance and area (PPA) for individual chiplets through integrated thermal, power and static timing analysis capabilities. (Nasdaq: CDNS) today announced the delivery of the Cadence ® Integrity ™ 3D-IC platform, the industry’s first comprehensive, high-capacity 3D-IC platform that integrates 3D design planning, implementation and system analysis in a single, unified cockpit. SAN JOSE, Calif., October 07, 2021-( BUSINESS WIRE)-Cadence Design Systems, Inc. Integrity 3D-IC integrates design planning, implementation and system analysis in a single, unified cockpitĭesigners can achieve system-driven PPA through the availability of integrated thermal, power and static timing analysis capabilitiesĬadence’s third-generation 3D-IC solution supports a wide range of application areas, including hyperscale computing, consumer, 5G communications, mobile and automotive Industry’s first comprehensive 3D-IC platform for multi-chiplet design and advanced packaging Highlights:

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